Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11723151 | Methods of creating exposed cavities in molded electronic devices | David Geiger, Venkat Iyer, Cheng Yang | 2023-08-08 |
| 11682603 | Control of thermal interface material in multi-chip package | Cheng Yang | 2023-06-20 |