Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848243 | Molded semiconductor package having a substrate with bevelled edge | Joon-seo Son | 2023-12-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848243 | Molded semiconductor package having a substrate with bevelled edge | Joon-seo Son | 2023-12-19 |