Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11669474 | Bus pipeline structure for die-to-die interconnect and chip | Sheau Jiung Lee | 2023-06-06 |
| 11622084 | Hyperspectral camera based on continuously variable film filter and coating method thereof | Xinghai Chen, Yelin Liu, Zhihui Huang, Yu Huang | 2023-04-04 |
| 11578992 | Method for updating strapdown inertial navigation solutions based on launch-centered earth-fixed frame | Kai Chen, Hanyan Sun, Mingxin Liu | 2023-02-14 |
| 11569715 | Integrated dual-motor controller | Shuwang Wang, Feng Liu, Jianhua Mao, Yong Cheng, Chunzhe Sun +1 more | 2023-01-31 |