Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11820885 | Resin composition, metal laminate and printed circuit board using same, and method for manufacturing metal laminate | Jinsoo Lee, Hyungkyu Kim | 2023-11-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11820885 | Resin composition, metal laminate and printed circuit board using same, and method for manufacturing metal laminate | Jinsoo Lee, Hyungkyu Kim | 2023-11-21 |