Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11677478 | Method for co-packaging light engine chiplets on switch substrate | Radhakrishnan L. Nagarajan, Liang Ding, Mark Patterson, Roberto Coccioli | 2023-06-13 |
| 11612079 | Heatsink for co-packaged optical switch rack package | Radhakrishnan L. Nagarajan, Liang Ding, Mark Patterson, Roberto Coccioli | 2023-03-21 |