Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769708 | Packaging-level chip and chip module packaged with magnetic cover, and electronic product | Yanwen Bai | 2023-09-26 |
| 11706878 | Multilayer circuit board | Yanwen Bai, Gang Zhao, Lin Chen | 2023-07-18 |