Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11789067 | Physical layer parameter compliance in high speed communication networks | — | 2023-10-17 |
| 11581292 | IC package with top-side memory module | Dan Azeroual | 2023-02-14 |
LA
Liav Ben Artsi
Overall (2023): #133,253 of 537,848Top 25%
2
Patents 2023