Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11754440 | Opto-mechanical structure design of thin LGA package with glass cover and a thickness of an aperture ceiling is 0.20MM | Sai Mun Lee | 2023-09-12 |
| 11562992 | Image module package having glass filter secured by transparent adhesive | Sai Mun Lee | 2023-01-24 |