Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810807 | Processing apparatus configured for processing wafers continuously under different processing conditions | Akiko Kigawa | 2023-11-07 |
| 11731239 | Processing apparatus | — | 2023-08-22 |
| 11667003 | Processing apparatus | Tetsuo Kubo | 2023-06-06 |
| 11577363 | Grinding method of bonded workpiece obtained by bonding transparent components or semitransparent components to each other | — | 2023-02-14 |