HN

Hiroyuki NISHINAKA

DE Denso: 1 patents #326 of 1,232Top 30%
MT Mirise Technologies: 1 patents #11 of 33Top 35%
NT National University Corporation Kyoto Institute Of Technology: 1 patents #1 of 10Top 10%
TO Toyota: 1 patents #1,513 of 3,791Top 40%
Overall (2023): #424,023 of 537,848Top 80%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11699600 Wafer processing apparatus and method for processing wafer Tatsuji Nagaoka, Hiroki Miyake, Yuki KAJITA, Masahiro Yoshimoto 2023-07-11