Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11794388 | Dual area bi-injection molding | Yonghong Duan, David W. Williams, Patrick A. Hampton, Anthony Howard | 2023-10-24 |
| 11792957 | System for cooling of computing components of an information handling system | Qinghong He, Michael Kotson | 2023-10-17 |
| 11569602 | Flexible input output mounting for solder joint stress reduction | Michael Kotson | 2023-01-31 |