Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11745384 | Multi-wall thickness, thin-walled honeycomb bodies, and extrusion dies and methods therefor | Ravindra Kumar Akarapu, Priyank Paras Jain, Weidong Li | 2023-09-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11745384 | Multi-wall thickness, thin-walled honeycomb bodies, and extrusion dies and methods therefor | Ravindra Kumar Akarapu, Priyank Paras Jain, Weidong Li | 2023-09-05 |