Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855038 | Method for assembling components implementing a pre-treatment of the solder bumps allowing an assembly by fluxless and residue-free soldering | Olivier Castany, Nohora-Lizeth Caicedo Panqueva, Yezouma-dieudonne Zonou | 2023-12-26 |