HL

Hung-Wen Lin

QU Qualcomm: 3 patents #511 of 2,295Top 25%
📍 New Taipei, TW: #160 of 1,884 inventorsTop 9%
Overall (2023): #77,484 of 537,848Top 15%
3
Patents 2023

Issued Patents 2023

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
11744045 Electronic device comprising a thermally conductive connector comprising graphite Sin-Shong Wang, Jen-Chun Chang, Qiang Du, Jorge Luis Rosales, Ajit Kumar Vallabhaneni 2023-08-29
11733749 Electronic device comprising thermally conductive connector Sin-Shong Wang, Keith Wang, Ajit Kumar Vallabhaneni, Jen-Chun Chang 2023-08-22
11637051 Integrated device coupled to a step heat sink configured to provide shielding Sin-Shong Wang, Jen-Chun Chang, Ajit Kumar Vallabhaneni, Keith Wang 2023-04-25