Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11639955 | Connectivity verification for flip-chip and advanced packaging technologies | Sanjay Sunder, Joseph V. Pampanin, Craig S. Appel | 2023-05-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11639955 | Connectivity verification for flip-chip and advanced packaging technologies | Sanjay Sunder, Joseph V. Pampanin, Craig S. Appel | 2023-05-02 |