WC

Wen-Fu Chou

CT Chipbond Technology: 2 patents #5 of 17Top 30%
Overall (2023): #97,393 of 537,848Top 20%
2
Patents 2023

Issued Patents 2023

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11812554 Layout structure of a flexible circuit board Yu Ma, Hsin-Hao Huang, Gwo-Shyan Sheu 2023-11-07
11581283 Flip chip package and circuit board thereof Yu Ma, Hsin-Hao Huang, Gwo-Shyan Sheu 2023-02-14