Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11662871 | Apparatus, system, and method for integrating conductive coil with injection-molded housing | Young Bae Kim, Jong Uk Kim, Aaron Steyskal | 2023-05-30 |
YC
Yang Chu
Overall (2023): #201,114 of 537,848Top 40%
1
Patents 2023