Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784721 | Reception device | Takanori KAWANAKA, Hiroyuki Ozaki | 2023-10-10 |
| 11712828 | Mold die, method of manufacturing mold die, injection molding apparatus, and method of manufacturing mold product | Tatsumi Onishi | 2023-08-01 |
| 11655119 | Sheet binding apparatus, sheet post processing apparatus having the sheet binding apparatus and image forming system having the sheet binding apparatus | — | 2023-05-23 |