Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830722 | Method of manufacturing package unit, package unit, electronic module, and equipment | Koichi Shimizu | 2023-11-28 |
| 11587964 | Method of manufacturing package unit, package unit, electronic module, and equipment | Koichi Shimizu | 2023-02-21 |