Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837530 | Lead frame with a support portion having a through hole over a heat dissipation plate, semiconductor device, and manufacturing method of lead frame | Jun Izuoka, Mitsuori Yoshimi | 2023-12-05 |
| 11667132 | Liquid discharge head and liquid discharge method | Yoshiyuki Nakagawa, Shintaro Kasai, Shuzo Iwanaga, Akiko Hammura, Takatsugu Moriya | 2023-06-06 |