Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742316 | Interconnect structure for semiconductor with ultra-fine pitch and forming method thereof | Chengqiang CUI, Peilin Liang, Jin Tong, Guannan YANG | 2023-08-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742316 | Interconnect structure for semiconductor with ultra-fine pitch and forming method thereof | Chengqiang CUI, Peilin Liang, Jin Tong, Guannan YANG | 2023-08-29 |