{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "2023", "item": "https://www.patentleaderboard.com/2023/"}, {"@type": "ListItem", "position": 3, "name": "Berry Global", "item": "https://www.patentleaderboard.com/2023/company/berry-global"}, {"@type": "ListItem", "position": 4, "name": "Roy E. ACKERMAN", "item": "https://www.patentleaderboard.com/2023/inventor/fl:ro_ln:ackerman-9"}]}

Home › 2023 › Berry Global › Roy E. ACKERMAN

Roy E. ACKERMAN — 2 Patents in 2023

BGBerry Global: 2 patents #5 of 37Top 15%

Evansville, IN: #11 of 76 inventorsTop 15%

Indiana: #464 of 3,533 inventorsTop 15%

Overall (2023): #115,195 of 537,848Top 25%

2 Patents 2023

Issued Patents 2023

Showing 1–2 of 2 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11679542	Process of forming polymeric material	Jonathan Eickhoff, Ryan Dewig, Jeffrey A. Mann, Dan EICHELBERGER, Holden W. BARNES +3 more	2023-06-20	$38,173,000
11667090	Method and apparatus for thermoforming an article	Jonathan Eickhoff, Ryan Dewig, Jeffrey A. Mann, Dan EICHELBERGER, Holden W. BARNES +1 more	2023-06-06	$18,968,000

Roy E. ACKERMAN — 2 Patents in 2023

Issued Patents 2023

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