Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855608 | Systems and methods for packaging an acoustic device in an integrated circuit (IC) | Huan En Ku, Joo Shan Yam | 2023-12-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855608 | Systems and methods for packaging an acoustic device in an integrated circuit (IC) | Huan En Ku, Joo Shan Yam | 2023-12-26 |