Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11723143 | Thermal dissipation and shielding improvement using merged PCB bottom copper post | Chang Kyu Choi, Sarah Haney, Li Sun | 2023-08-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11723143 | Thermal dissipation and shielding improvement using merged PCB bottom copper post | Chang Kyu Choi, Sarah Haney, Li Sun | 2023-08-08 |