Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11698229 | Three-dimensional heat dissipating device | Chih-Wei Chen, Tien-Yao CHANG, Che-Wei KUO, Hsiang-Chih Chuang, Jyun-Wei Huang | 2023-07-11 |
| 11653471 | Heat dissipation device | Chih-Wei Chen, Jyun-Wei Huang | 2023-05-16 |
| 11576279 | Heat dissipation device | Chih-Wei Chen, Jyun-Wei Huang | 2023-02-07 |
| 11553621 | Heat dissipation base | Ming-Yuan LO, Ching-An LIU | 2023-01-10 |