Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11574849 | Package with embedded electronic component being encapsulated in a pressureless way | Gernot Schulz | 2023-02-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11574849 | Package with embedded electronic component being encapsulated in a pressureless way | Gernot Schulz | 2023-02-07 |