Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11612089 | Component placement systems and methods of operating the same | Rudolphus H. Hoefs, Wilhelmus Gijsbertus Leonardus Van Sprang | 2023-03-21 |
| 11557567 | Methods of attaching die to substrate using compliant die attach system having spring-driven bond tool | Rudolphus H. Hoefs, Richard A. Van Der Burg | 2023-01-17 |