Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798911 | Force sensor in an ultrasonic wire bonding device | Hing Leung Li, Hoi Ting LAM, Tsz Kit YU | 2023-10-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798911 | Force sensor in an ultrasonic wire bonding device | Hing Leung Li, Hoi Ting LAM, Tsz Kit YU | 2023-10-24 |