Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11814728 | Method for filling a gap in a three-dimensional structure on a semiconductor substrate | HakYong Kwon, HieChul Kim, SungKyu Kang, Seunghwan Lee, SungBae Kim +4 more | 2023-11-14 |