Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854934 | Package with heat dissipating substrate | Noriyasu Yamamoto, Yoshikazu Mihara | 2023-12-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854934 | Package with heat dissipating substrate | Noriyasu Yamamoto, Yoshikazu Mihara | 2023-12-26 |