Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682465 | Reliable through-silicon vias | Zheng Gong, Jiao Wang | 2023-06-20 |
| 11563945 | Adaptive offset for variance based quantization | Jiao Wang, Ying Zhang, Richard E. George, Edward A. Harold | 2023-01-24 |