Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11835595 | Chip and chip testing method | Kai LEI, Yudan Deng, Linglan Zhang, Jinfu Ye, Huan Liu | 2023-12-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11835595 | Chip and chip testing method | Kai LEI, Yudan Deng, Linglan Zhang, Jinfu Ye, Huan Liu | 2023-12-05 |