Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11631624 | Semiconductor chip package with spring biased lid | William J. Maxwell | 2023-04-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11631624 | Semiconductor chip package with spring biased lid | William J. Maxwell | 2023-04-18 |