Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721651 | Communication between integrated circuit (IC) dies in wafer-level fan-out package | Chi Fung Poon, Parag Upadhyaya | 2023-08-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721651 | Communication between integrated circuit (IC) dies in wafer-level fan-out package | Chi Fung Poon, Parag Upadhyaya | 2023-08-08 |