Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11724341 | Lead-free solder alloy, solder joining material, electronic circuit mounting substrate, and electronic control device | Yurika Munekawa, Takeshi Nakano, Takanori SHIMAZAKI, Tsukasa KATSUYAMA | 2023-08-15 |