Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11732162 | Anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux additives and method of connecting electronic parts using the same | KyoungWook Paik | 2023-08-22 |
| 11713365 | Method for preparing modified conjugated diene-based polymer | Hyo Jin Bae, Jeong Heon Ahn, Suk Youn Kang | 2023-08-01 |