Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682653 | Semiconductor device package and method for manufacturing the same | Chih-Ming Hung, Tsung-Yueh Tsai, Jen-Kai Ou | 2023-06-20 |
| 11626525 | Package structure and method for manufacturing the same | Chun Yu KO, Tsu-Hsiu Wu | 2023-04-11 |
| 11605598 | Semiconductor device package and method of manufacturing the same | Wei-Da Lin, Hung Chen Kuo, Wen Jin Huang | 2023-03-14 |