Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11605598 | Semiconductor device package and method of manufacturing the same | Wei-Da Lin, Meng-Jen Wang, Wen Jin Huang | 2023-03-14 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11605598 | Semiconductor device package and method of manufacturing the same | Wei-Da Lin, Meng-Jen Wang, Wen Jin Huang | 2023-03-14 |