Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791280 | Semiconductor device package and method of manufacturing the same | Pai-Chou Liu, Yun-Chih FEI, Wen-Pin Huang, Sheng-Hong Zheng | 2023-10-17 |
| 11658170 | Semiconductor package structure and methods of manufacturing the same | Wei-Tsung Chen, Paofa WANG | 2023-05-23 |
| 11637055 | Semiconductor device package | Wen-Pin Huang | 2023-04-25 |