Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824031 | Semiconductor package structure with dielectric structure covering upper surface of chip | Chih-Cheng Lee | 2023-11-21 |
| 11658102 | Semiconductor device package and method of manufacturing the same | Yuanhao Yu, Cheng-Yuan Chen, Chun-Chen Chen, Chien-Wen Tu | 2023-05-23 |
| 11552026 | Semiconductor packages and methods of manufacturing the same | Cheng-Yuan Chen, Chun-Chen Chen, Yuanhao Yu | 2023-01-10 |