Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837572 | Apparatus and method for manufacturing semiconductor package structure | Chun-Min Wu | 2023-12-05 |
| D992751 | Sample processing instrument | Xi Liu, Jingzhang WU | 2023-07-18 |
| 11687306 | Displaying control method | I-Jen Wen | 2023-06-27 |