Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804461 | Semiconductor package structure and method of manufacturing the same | Yu-Ping Tsai, Ming-Chi Liu, Yu-Ting Lu, Kai-Chiang Hsu | 2023-10-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804461 | Semiconductor package structure and method of manufacturing the same | Yu-Ping Tsai, Ming-Chi Liu, Yu-Ting Lu, Kai-Chiang Hsu | 2023-10-31 |