Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11845885 | Dual stage structural bonding adhesive | Matthew J. Schmid, Cyrus A. Anderson, Kathleen S. Shafer, James M. Nelson | 2023-12-19 |
| 11773295 | Methods of bonding substrates together | Cyrus A. Anderson, Thomas Q. Chastek, Kathleen S. Shafer, Sheng Ye | 2023-10-03 |