Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11773254 | Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods | Brett A. Beiermann, John C. Clark, Eric G. Larson, Jeremy M. Higgins, Jay R. Lomeda +5 more | 2023-10-03 |