Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11524491 | Method for manufacturing thick polyimide film | Wei Huang, CHI-FEI HUANG, SHOU-JUI HSIANG, Kuan-Wei Lee | 2022-12-13 |
| 11261328 | Circuit board using low dielectric resin composition | SHOU-JUI HSIANG, Mao-Feng Hsu, MING-JAAN HO | 2022-03-01 |