Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11510319 | Connecting structure | RUI-WU LIU, Man-Zhi Peng | 2022-11-22 |
| 11483938 | Method for connecting stacked circuit boards | RUI-WU LIU, Man-Zhi Peng | 2022-10-25 |
| 11457532 | Method of manufacturing circuit board | FU-YUN SHEN, HSIAO-TING HSU, Lin Gao | 2022-09-27 |
| 11380603 | Method for making a heat dissipation structure | FU-YUN SHEN, Cong Lei, HSIAO-TING HSU | 2022-07-05 |
| 11297748 | Electromagnetic shielding film | FU-YUN SHEN, HSIAO-TING HSU | 2022-04-05 |
| 11296444 | Edge-to-edge board connection structure | Man-Zhi Peng | 2022-04-05 |
| 11261328 | Circuit board using low dielectric resin composition | SZU-HSIANG SU, SHOU-JUI HSIANG, Mao-Feng Hsu | 2022-03-01 |
| 11259405 | Transmission circuit board and method for manufacturing the same | FU-YUN SHEN, Wen-Zhu Wei | 2022-02-22 |
| 11252818 | Printed circuit board and method for manufacturing the same | RUI-WU LIU, Lei Zhou, Man-Zhi Peng | 2022-02-15 |