Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11286386 | Circuit build-up film for wafer-level packaging, and fabrication method and use thereof | De Wu, Yi-Ching Wang, Junxing Su, Feifei Liang | 2022-03-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11286386 | Circuit build-up film for wafer-level packaging, and fabrication method and use thereof | De Wu, Yi-Ching Wang, Junxing Su, Feifei Liang | 2022-03-29 |