Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11286386 | Circuit build-up film for wafer-level packaging, and fabrication method and use thereof | De Wu, Shuhang Liao, Junxing Su, Feifei Liang | 2022-03-29 |
| 11269234 | Reflective display device | Chia-Chi Chang, Chih-Chun Chen, Chi-Ming Wu, Jia-Hung Chen, Cheng-Hsien Lin | 2022-03-08 |
| 11227557 | Display device | Chia-Chi Chang, Chih-Chun Chen, Chi-Ming Wu, Jia-Hung Chen | 2022-01-18 |