Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450534 | Packaging process for side-wall plating with a conductive film | Longnan Jin, Junfeng Liu, Huiying Ding, Thomas Schmidt | 2022-09-20 |
| 11393699 | Packaging process for plating with selective molding | Huiying Ding, Junfeng Liu, Longnan Jin, Thomas Schmidt | 2022-07-19 |