Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450534 | Packaging process for side-wall plating with a conductive film | Longnan Jin, Heinrich Karrer, Huiying Ding, Thomas Schmidt | 2022-09-20 |
| 11443228 | Job merging for machine and deep learning hyperparameter tuning | Kuan Feng, Zhichao Su, Yi San Zhao | 2022-09-13 |
| 11393699 | Packaging process for plating with selective molding | Huiying Ding, Longnan Jin, Heinrich Karrer, Thomas Schmidt | 2022-07-19 |
| 11214148 | Distributed high-frequency AC electrical system for the electric vehicle | Jialei Wu, Jun Zeng, Fei Luo | 2022-01-04 |